IC PACKAGING FAIR 2025
IC PACKAGING FAIR 2025 will be held 2026/10/01， at the Shenzhen World Exhibition & Convention Center in Shenzhen (China). DescriptionIC Packaging Fair. Laminating technology and equipment, Soldering equipment, Test and measurement equipment, Laboratory test and measurement equipment, PCBA section test and measurement equipment, Finished product assembly section test and measurement... The following is the detailed information of this exhibition. Since the exhibition time may change, please be sure to confirm it before participating.
- CityShenzhen (China)
- Date2026-10-01
- Related industriesElectronic Design & Components。Applied Computer & Industrial Engineering。
- VenueShenzhen World Exhibition & Convention Center
- Organizers(s)RX China/RX Global Events/
- AudienceTrade Public
- Cycleonce a year
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Zhejiang 16009103
Copyright 2010 TradingChem Group Ltd.
All Rights Reserved. No Unauthorized Reproduction or Duplication of Any Kind.
Zhejiang 16009103