ADHESION & BONDING EXPO - OSAKA 2026
ADHESION & BONDING EXPO - OSAKA 2026 will be held 2027/05/01， at the Intex Osaka in Osaka (Japan). DescriptionInternational Trade Fair for Adhesive & Joining Technologies. "Adhesion & Bonding Expo" is the leading industrial adhesion expo that gathers joining equipment and bonding technologies from materials to welding, friction stirring, ultrasonic, diffusion... The following is the detailed information of this exhibition. Since the exhibition time may change, please be sure to confirm it before participating.
- CityOsaka (Japan)
- Date2027-05-01
- Related industriesAdhesion, Paints & Coating Technologies。Surface Treatment Technologies - Coatings。Plastics, Rubber, Composites。
- VenueIntex Osaka
- Organizers(s)RX Japan/RX Global Events/
- AudienceTrade Public
- Cycleonce a year
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Zhejiang 16009103
Copyright 2010 TradingChem Group Ltd.
All Rights Reserved. No Unauthorized Reproduction or Duplication of Any Kind.
Zhejiang 16009103